HSB21-454515

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Overview of HSB21-454515

Part NumberHSB21-454515
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 45 X 45 X 15 MM
DatasheetsDownload HSB21-454515 Datasheet PDFPDF Icon
Price for HSB21-454515

Specification of HSB21-454515

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
1.772" (45.00mm)
Width
1.772" (45.00mm)
Diameter
-
Fin Height
0.591" (15.00mm)
Power Dissipation @ Temperature Rise
9.9W @ 75C
Thermal Resistance @ Forced Air Flow
2.80C/W @ 200 LFM
Thermal Resistance @ Natural
7.56C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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