HSB22-606010

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Overview of HSB22-606010

Part NumberHSB22-606010
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 60 X 60 X 10 MM
DatasheetsDownload HSB22-606010 Datasheet PDFPDF Icon
Price for HSB22-606010

Specification of HSB22-606010

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
2.362" (60.00mm)
Width
2.362" (60.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
9.8W @ 75C
Thermal Resistance @ Forced Air Flow
2.60C/W @ 200 LFM
Thermal Resistance @ Natural
7.62C/W
Material
Aluminum
Material Finish
Black Anodized

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