HSB12-272706

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Overview of HSB12-272706

Part NumberHSB12-272706
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 27 X 27 X 6 MM
DatasheetsDownload HSB12-272706 Datasheet PDFPDF Icon
Price for HSB12-272706

Specification of HSB12-272706

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.236" (6.00mm)
Power Dissipation @ Temperature Rise
3.8W @ 75C
Thermal Resistance @ Forced Air Flow
7.80C/W @ 200 LFM
Thermal Resistance @ Natural
19.59C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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