HSB16-404018

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Overview of HSB16-404018

Part NumberHSB16-404018
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 40 X 40 X 18 MM
DatasheetsDownload HSB16-404018 Datasheet PDFPDF Icon
Price for HSB16-404018

Specification of HSB16-404018

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
1.575" (40.00mm)
Width
1.575" (40.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
9.4W @ 75C
Thermal Resistance @ Forced Air Flow
2.60C/W @ 200 LFM
Thermal Resistance @ Natural
7.96C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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