HSB18-232310

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Overview of HSB18-232310

Part NumberHSB18-232310
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 23 X 23 X 10 MM
DatasheetsDownload HSB18-232310 Datasheet PDFPDF Icon
Price for HSB18-232310

Specification of HSB18-232310

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.906" (23.00mm)
Width
0.906" (23.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
3.7W @ 75C
Thermal Resistance @ Forced Air Flow
6.80C/W @ 200 LFM
Thermal Resistance @ Natural
20.41C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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