Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
| Part Number | HSB19-272718 |
| Manufacturer | CUI Devices |
| Description | HEAT SINK, BGA, 27 X 27 X 18 MM |
| Datasheets | Download HSB19-272718 Datasheet PDF |
| Price for HSB19-272718 | |
HSB19-272718 is in Stock, Find HSB19-272718 electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for HSB19-272718 to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.
Email us: [email protected] or RFQ HSB19-272718 Online.
When you find the right product you want, click the "Get a quote" button, and fill the rest of the information(part number, quantity, target price, your contact infomation, etc.) or you can contact our team via email [email protected].
Bank Wire Transfer (T/T), Western Union, PayPal (Credit Card). We accept payment via Bank Wire Transfer (T/T) and other payment way for special customer. T/T Bank Charges USD8.40 to USD30.00, HK HSBC to HK HSBC, don’t need any charges. Please note that we accept payment in USD and EURO, GBP, HKD.
By using main international couriers like DHL, FedEx, UPS, TNT, EMS, HongKong mail, China Post, etc. standard delivery time is 2-5 business days depending on destination. specified shipping methods may be discussed, it all depand on clients' needs and we make sure products arrive safe and fast.
You can still summit the part number by fill in the RFQ form or E-mail us directly.
