HSB05-171711

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Overview of HSB05-171711

Part NumberHSB05-171711
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 17 X 17 X 11.5 M
DatasheetsDownload HSB05-171711 Datasheet PDFPDF Icon
Price for HSB05-171711

Specification of HSB05-171711

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.669" (17.00mm)
Width
0.669" (17.00mm)
Diameter
-
Fin Height
0.453" (11.50mm)
Power Dissipation @ Temperature Rise
3.1W @ 75C
Thermal Resistance @ Forced Air Flow
8.40C/W @ 200 LFM
Thermal Resistance @ Natural
23.91C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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