HSB04-171706

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Overview of HSB04-171706

Part NumberHSB04-171706
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 17 X 17 X 6 MM
DatasheetsDownload HSB04-171706 Datasheet PDFPDF Icon
Price for HSB04-171706

Specification of HSB04-171706

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.669" (17.00mm)
Width
0.669" (17.00mm)
Diameter
-
Fin Height
0.236" (6.00mm)
Power Dissipation @ Temperature Rise
2.5W @ 75C
Thermal Resistance @ Forced Air Flow
13.10C/W @ 200 LFM
Thermal Resistance @ Natural
29.73C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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