HSB02-101007

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of HSB02-101007

Part NumberHSB02-101007
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 10 X 10 X 7 MM
DatasheetsDownload HSB02-101007 Datasheet PDFPDF Icon
Price for HSB02-101007

Specification of HSB02-101007

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.394" (10.00mm)
Width
0.394" (10.00mm)
Diameter
-
Fin Height
0.275" (7.00mm)
Power Dissipation @ Temperature Rise
2.0W @ 75C
Thermal Resistance @ Forced Air Flow
16.50C/W @ 200 LFM
Thermal Resistance @ Natural
37.90C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

HSB02-101007 is in Stock, Find HSB02-101007 electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for HSB02-101007 to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ HSB02-101007 Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page