HSB03-121218

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Overview of HSB03-121218

Part NumberHSB03-121218
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 12 X 12 X 18 MM
DatasheetsDownload HSB03-121218 Datasheet PDFPDF Icon
Price for HSB03-121218

Specification of HSB03-121218

Status
Active
Series
HSB
Package
Tray
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.472" (12.00mm)
Width
0.472" (12.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
3.1W @ 75C
Thermal Resistance @ Forced Air Flow
9.60C/W @ 200 LFM
Thermal Resistance @ Natural
24.01C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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