HSB01-080808

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Overview of HSB01-080808

Part NumberHSB01-080808
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 8.5 X 8.5 X 8 MM
DatasheetsDownload HSB01-080808 Datasheet PDFPDF Icon
Price for HSB01-080808

Specification of HSB01-080808

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.335" (8.50mm)
Width
0.335" (8.50mm)
Diameter
-
Fin Height
0.315" (8.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75C
Thermal Resistance @ Forced Air Flow
16.00C/W @ 200 LFM
Thermal Resistance @ Natural
39.10C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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